computational molecular dynamics simulation temperature-based targeted molecular dynamics Search Results


multiphysics simulation software  (COMSOL Inc)
90
COMSOL Inc multiphysics simulation software
Multiphysics Simulation Software, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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Average 90 stars, based on 1 article reviews
multiphysics simulation software - by Bioz Stars, 2026-09
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temperature profiles  (COMSOL Inc)
90
COMSOL Inc temperature profiles
Temperature Profiles, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/computational+molecular+dynamics+simulation+temperature-based+targeted+molecular+dynamics/temperature+profiles/pmc08232904-99-11-6
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temperature profiles - by Bioz Stars, 2026-09
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comsol-based heat transfer simulations  (COMSOL Inc)
90
COMSOL Inc comsol-based heat transfer simulations
Comsol Based Heat Transfer Simulations, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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comsol-based temperature field simulation results  (COMSOL Inc)
90
COMSOL Inc comsol-based temperature field simulation results
Comsol Based Temperature Field Simulation Results, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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comsol-based temperature field simulation results - by Bioz Stars, 2026-09
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ashrae rp884  (ASHRAE Inc)
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ASHRAE Inc ashrae rp884
Ashrae Rp884, supplied by ASHRAE Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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ashrae rp884 - by Bioz Stars, 2026-09
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comsol multiphysics simulation  (COMSOL Inc)
90
COMSOL Inc comsol multiphysics simulation
Comsol Multiphysics Simulation, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/computational+molecular+dynamics+simulation+temperature-based+targeted+molecular+dynamics/comsol+multiphysics/pm38076430-56-12-11
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comsol multiphysics simulation - by Bioz Stars, 2026-09
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finite element simulation model  (COMSOL Inc)
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COMSOL Inc finite element simulation model
Finite Element Simulation Model, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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Average 90 stars, based on 1 article reviews
finite element simulation model - by Bioz Stars, 2026-09
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solving complex heat-mass flowequations ansys-fluent  (ANSYS inc)
90
ANSYS inc solving complex heat-mass flowequations ansys-fluent
Solving Complex Heat Mass Flowequations Ansys Fluent, supplied by ANSYS inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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multiphysics heat transfer simulations  (COMSOL Inc)
90
COMSOL Inc multiphysics heat transfer simulations
COMSOL <t>Multiphysics</t> 5.3a finite element method heat transfer simulations of a 0.75 mm deep chamber with different heater widths and heater spacings. Panel ( a ) shows the schematics with the materials indicated in the figure and the heaters exaggerated in red (they are 1 dimensional lines in the simulation model). Panel ( b ) shows the case for 0.3 mm heater width and 0.3 mm heater spacing. Panel ( c ) shows the case for 0.3 mm heater width and 2.0 mm heater spacing. The scale bar in panel ( d ) is in °C and applies to both panels ( b ) and ( c ).
Multiphysics Heat Transfer Simulations, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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Average 90 stars, based on 1 article reviews
multiphysics heat transfer simulations - by Bioz Stars, 2026-09
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epoxy poss composites  (Molecular Dynamics Inc)
86
Molecular Dynamics Inc epoxy poss composites
COMSOL <t>Multiphysics</t> 5.3a finite element method heat transfer simulations of a 0.75 mm deep chamber with different heater widths and heater spacings. Panel ( a ) shows the schematics with the materials indicated in the figure and the heaters exaggerated in red (they are 1 dimensional lines in the simulation model). Panel ( b ) shows the case for 0.3 mm heater width and 0.3 mm heater spacing. Panel ( c ) shows the case for 0.3 mm heater width and 2.0 mm heater spacing. The scale bar in panel ( d ) is in °C and applies to both panels ( b ) and ( c ).
Epoxy Poss Composites, supplied by Molecular Dynamics Inc, used in various techniques. Bioz Stars score: 86/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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Average 86 stars, based on 1 article reviews
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numerical heat conduction simulation  (COMSOL Inc)
90
COMSOL Inc numerical heat conduction simulation
COMSOL <t>Multiphysics</t> 5.3a finite element method heat transfer simulations of a 0.75 mm deep chamber with different heater widths and heater spacings. Panel ( a ) shows the schematics with the materials indicated in the figure and the heaters exaggerated in red (they are 1 dimensional lines in the simulation model). Panel ( b ) shows the case for 0.3 mm heater width and 0.3 mm heater spacing. Panel ( c ) shows the case for 0.3 mm heater width and 2.0 mm heater spacing. The scale bar in panel ( d ) is in °C and applies to both panels ( b ) and ( c ).
Numerical Heat Conduction Simulation, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/computational+molecular+dynamics+simulation+temperature-based+targeted+molecular+dynamics/transient+heat+transfer+conduction+package/pm35110761-502-25-30
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numerical heat conduction simulation - by Bioz Stars, 2026-09
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icepak-simulated chip temperature distribution  (ANSYS inc)
90
ANSYS inc icepak-simulated chip temperature distribution
COMSOL <t>Multiphysics</t> 5.3a finite element method heat transfer simulations of a 0.75 mm deep chamber with different heater widths and heater spacings. Panel ( a ) shows the schematics with the materials indicated in the figure and the heaters exaggerated in red (they are 1 dimensional lines in the simulation model). Panel ( b ) shows the case for 0.3 mm heater width and 0.3 mm heater spacing. Panel ( c ) shows the case for 0.3 mm heater width and 2.0 mm heater spacing. The scale bar in panel ( d ) is in °C and applies to both panels ( b ) and ( c ).
Icepak Simulated Chip Temperature Distribution, supplied by ANSYS inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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Image Search Results


COMSOL Multiphysics 5.3a finite element method heat transfer simulations of a 0.75 mm deep chamber with different heater widths and heater spacings. Panel ( a ) shows the schematics with the materials indicated in the figure and the heaters exaggerated in red (they are 1 dimensional lines in the simulation model). Panel ( b ) shows the case for 0.3 mm heater width and 0.3 mm heater spacing. Panel ( c ) shows the case for 0.3 mm heater width and 2.0 mm heater spacing. The scale bar in panel ( d ) is in °C and applies to both panels ( b ) and ( c ).

Journal: Micromachines

Article Title: Disposable DNA Amplification Chips with Integrated Low-Cost Heaters †

doi: 10.3390/mi11030238

Figure Lengend Snippet: COMSOL Multiphysics 5.3a finite element method heat transfer simulations of a 0.75 mm deep chamber with different heater widths and heater spacings. Panel ( a ) shows the schematics with the materials indicated in the figure and the heaters exaggerated in red (they are 1 dimensional lines in the simulation model). Panel ( b ) shows the case for 0.3 mm heater width and 0.3 mm heater spacing. Panel ( c ) shows the case for 0.3 mm heater width and 2.0 mm heater spacing. The scale bar in panel ( d ) is in °C and applies to both panels ( b ) and ( c ).

Article Snippet: Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch of chips has been fabricated and successful multiple displacement amplification reactions are performed inside these chips.

Techniques:

Three temperature differences within the system. In panel ( a ) the Δ T top of chamber , in panel ( b ) the Δ T across chamber , in panel ( c ) the Δ T bottom of chamber , and in panel ( d ) the Δ T deviation from set T are shown for different heater widths (0.3 mm to 2.0 mm, in the columns) and heater spacings (0.3 mm to 2.0 mm, in the rows). The differences are obtained using a parametric sweeps for both the heater width and heater spacing in the COMSOL Multiphysics 5.3a finite element method heat transfer simulations. The cells in dark indicate the smallest Δ T and the cells in white the largest Δ T .

Journal: Micromachines

Article Title: Disposable DNA Amplification Chips with Integrated Low-Cost Heaters †

doi: 10.3390/mi11030238

Figure Lengend Snippet: Three temperature differences within the system. In panel ( a ) the Δ T top of chamber , in panel ( b ) the Δ T across chamber , in panel ( c ) the Δ T bottom of chamber , and in panel ( d ) the Δ T deviation from set T are shown for different heater widths (0.3 mm to 2.0 mm, in the columns) and heater spacings (0.3 mm to 2.0 mm, in the rows). The differences are obtained using a parametric sweeps for both the heater width and heater spacing in the COMSOL Multiphysics 5.3a finite element method heat transfer simulations. The cells in dark indicate the smallest Δ T and the cells in white the largest Δ T .

Article Snippet: Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch of chips has been fabricated and successful multiple displacement amplification reactions are performed inside these chips.

Techniques: